Major Factors Driving Growth Of The Global Die Bonder Equipment Market: Various processes, including eutectic bonding, soldering, adhesive bonding, and glass/silver-glass bonding are used in die bonding process. The most typical method of die bonding is to use a pin to push desired die away from the tape. Various methods such as epoxy, eutectic, soft solder, and flip chip, are also employed to attach die to the substrate. A die attaching equipment's primary duty is to pick die from wafer or waffle tray and connect it to substrate. Die binders and die attaching equipment are two terms for same thing. As a result, die bonder equipment is widely employed in semiconductor device manufacture. Other factors such as increasing complexity of semiconductor IC designs and rising demand for high-quality semiconductor ICs for wireless applications are expected to support market growth going ahead.ĭie binders are a form of semiconductor packaging and assembly equipment that is used to adhere a chip to a package or substrate. Market revenue growth is attributed to rising demand for small electronic components and increasing implementation of stacked die technology in Internet of Things (IoT) devices. The global die bonder equipment market size was significantly robust in 2020 and is expected to register a steady revenue CAGR over the forecast period.
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